- Toolas

Baltic Photonics 2022 Advances in Laser Micromachining

Conference, B2B events, field visits

“Baltic Photonics” is the annual platform that brings together the photonics technology experts and leaders to discuss technology developments, applications, and challenges as well as attracts representatives of cross-sectorial industries to discuss key challenges and needs.

This year’s Baltic Photonics Conference is dedicated to Laser Micromachining and its applications.

Date: 21-23 September, 2022

Location: Visoriai IT Park (Mokslininku str. 2a, 08412, Vilnius, Lithuania). How to get there

Fee: Free of charge

BP 2022 is to bring together a multi-disciplinary group of innovators regarding our industry from all corners of the globe to encompass the current state of the industry, and of course share cutting-edge ideas in the fields of lasers, optics, and photonics.

Representatives of cross-sectorial industries are welcome to join the conference to share their products, ideas, and look for potential partners as well as discussing key challenges and needs.

This year’s conference will consist of 3 main parts:

Conference (21-22th of September)
B2B events (short meeting sessions, long coffee breaks, evening events) (21-22th of September)
Field visits to companies located in Vilnius (21 and 23th of September)

Keywords of the conference: Photonics, laser micromachining, optics, security & defense

Suggested topics of the conference:

Laser micromachining
Laser additive manufacturing
Laser sources and systems
Optics (Laser processing, Optical systems, Artificial Intelligence for Optronics)
Experience of successful partnerships
Imaging & Systems
Laser Sensor & Systems
Security & Defense Applications & Technologies

Bus transfers (field visits day) on 23th of September will be organized to and from this hotel only and paid by organizer.

Join the conference as a speaker, or participant and see photonics opportunities in Lithuania!

Program (EEST time):

21 September, 2022

10:00 – 10:30

Registration / Welcome coffee

10:30 – 12:30
1 Session

10:30-11:00
Welcome speeches
Saulius Arelis, CEO of VITP (LT)

11:00-11:30
TBC
Dr. Gediminas Račiukaitis, President of the Lithuanian Laser Association and Head of the Laser Technologies Department at the Center for Physical Sciences and Technology (FTMC) (LT)

11:30-12:00

Laser additive manufacturing
Prof. Mangirdas Malinauskas, Research Director at Laser Research Center of Vilnius University (LT)

12:00-12:30
TBC
Roman Tarask, Lumibird (FR)

12:30 – 13:30
Lunch

13:30 – 15:00
Session 2: Short presentations

13:30-15:00
Short presentations of participants
List will be provided soon

You are welcome to conduct a 10 min presentation, and to have B2B meetings with other participants in short session. (Please fill-in information in registration form)

15:00 – 16:00
Coffee break & B2B sessions

16:00 – 18:00
Session 3: Field visits

16:00-18:00
Visits to companies in Visoriai area (Moksininku str 2a, 6a, 6b)
List of possible companies to visit: Optogama, Akoneer, Optonas, DMC, Protogama, Tektas, WOP, EvanaTechnologies, etc.

19:00 – 23:00
Networking event (program will be provided)

22 September, 2022

09:00 – 09:30

Morning coffee

09:30 – 11:00
Session 4: Main presentations

09:30-10:00
Machine and process control software as a platform for building better systems faster
Šarūnas Vaškelis, DMC (LT)

10:00-10:30
Advanced laser triggering for increasing throughput in laser micromachining.
Xavier Wolters, Amplitude (NL)

10:30-11:00
TBC
TBC

11:00 – 11:30
Coffee Break

11:30 – 13:00
Session 5: Main presentations

11:30-12:00
TBC
Rokas Šlekys, Akoneer (LT)

12:00-12:30
Laser dicing technologies for semiconductor industry
Egidijus Vanagas, Evana Technologies (LT)

Developed technologies for high speed (up to 2000 mm/s) dicing of thin (up to 150 mm thick) semiconductor wafers.

ICICLE technology for high density microelectronics devices chip singulation on silicon (Si) wafer. Dicing of more thick Si wafer (up to 700 µm), speed is up to 600 mm/s, high accuracy, high throughput, no chipping, no debris, easy breaking.
Thermal Laser Cleaving (TLC) technology for high power (HP) and Radio Frequency (RF) microelectronics devices chip singulation on silicon carbide (SiC) wafer (back side metal coated). Dicing of more thick SiC wafer (up to 500 µm), speed is up to 600 mm/s, high accuracy, high throughput, no chipping, little debris, easy breaking.
Tools: the hardware and software to dedicated optical engines for both technologies are provided, demonstrations on commercial basis are possible.
the techniques allows straight and curved cleaving and breaking of the wafers.

12:30-13:00
TBC
TBC, Light Conversion (LT)

13:00 – 14:00
Lunch

14:00 – 15:30
Session 6: Short presentations

14:00-15:30
Short presentations of participants
Femtika, etc.

You are welcome to conduct a 10 min presentation, and to have B2B meetings with other participants in short session. (Please fill-in information in registration form)

15:30 – 18:00
Coffee break & B2B sessions