10:00 – 10:30

Registration / Welcome coffee

10:30 – 12:30
1 Session

10:30-11:00
Welcome speeches
Representative of VITP, Gediminas Račiukaitis (Lithuanian Laser Association), prof. Mangirdas Malinauskas (Laser Research Center of Vilnius University), akad. Jūras Banys (The Lithuanian Academy of Science)

11:00-11:30
Micromachining opportunities utilising ultrashort pulses lasers
Dr. Gediminas Račiukaitis, President of the Lithuanian Laser Association and Head of the Laser Technologies Department at the Center for Physical Sciences and Technology (FTMC) (LT)

Ultrashort pulse lasers, generating light pulses with durations in the picosecond and femtosecond range, are becoming robust tools in precision laser microfabrication. They are benefiting not only from well-predicted laser ablation with the suppressed heat-affected zone but also by opening new processing opportunities, especially in transparent materials, due to enhanced non-linear interaction with the material. This presentation reviews some recent results of our research. and discussed.

11:30-12:00
Ultrafast laser 3D micro-nano additive manufacturing of bioresins and inorganics
Prof. Mangirdas Malinauskas, Research Director at Laser Research Center of Vilnius University (LT)

An ultrafast laser multi-scale lithography has established itself as an optical 3D printing tool. Progress is driven on 3D as well as 4D printing of diverse materials ranging from biocompatible, biodegradable and renewable organics to amorphous, ceramic and crystalline inorganics. Immediate applications are micro-optical and nano-photonic components as well as bio-medical implants. 

12:00-12:30
Laser Shock Peening
Kim Grundström, Ab Kimmy Photonics Oy (FI)

An introduction to a relatively new surface treatment for various applications and materials. An overview of suitable and available laser sources will be presented and discussed.

13:30 – 15:00
Session 2: Short presentations

13:30-15:00
Short presentations of participants

13:30-13:45
Laser hybrid fabrication: combining different technologies in one micro-device
Agnė Butkutė, Femtika (LT)

A femtosecond laser is a powerful tool to perform many different laser material processing techniques such as two-photon polymerization, selective glass etching, and ablation. Femtika combines a few laser material processing techniques in one laser workstation for microdevices fabrication. Mentioned devices can be used in many applications starting from optics and photonics to biomedical applications.

13:45-14:00
Beam delivery devices for laser micromachining systems
Matas Plukys, Optogama (LT)
Precise, fast, and innovative laser beam parameter control leads to advanced micromachining applications. Optogama develops and manufactures multiple-function beam delivery devices, which become part of the micromachining system. The devices help to ensure compactness, integrability, speed, automatization, and precision for optimum system performance.

14:00-14:15
Physik Instrumente (PI) the solution provider for your task
Rolf Ellerbrock, PI (DE)
Physik Instrumente (PI) the solution provider for your task in the Micro- and Nano-Positioning for Semiconductor, Laser Material Processing, Life Science and Metrology Applications

14:15-14:30
Introducing Renishaw
Andrei Yuriev, Renishaw (PL)
We are global company with core skills in measurement, motion control, healthcare, spectroscopy and manufacturing.

14:30-14:45
Tips & tricks for transparent materials micromachining
Martynas Adomaitis, WOP (LT)
WOP has a long-lasting extensive knowledge in femtosecond laser micromachining focusing on transparent materials.
This presentation will review the main novelties in transparent material micromachining, SLE technology’s impact on exceptional properties, our new achievements in microfluidics and micro devices manufacturing, and a brand new glass dicing laser system ideal for thin glass microfabrication.

14:45-15:00
Coatings for laser optics and not only
Audrius Valavičius, Optonas (LT)
Tough coatings as a part of your micromachining system.

16:00 – 18:00
Session 3: Field visits

16:00-18:00
Visits to companies in Visoriai area (Moksininku str 2a, 6b)
List of possible companies to visit: Optogama, Akoneer, Optonas, DMC, Protogama, WOP.

09:30 – 11:00
Session 4: Main presentations

09:30-10:00
Machine and process control software as a platform for building better systems faster
Tauras Papinigis, DMC (LT)
Engineers from application laboratories and OEMs have been used to spending a lot of their effort juggling too many different interfaces and writing thousands of lines of code to achieve various laser processes. DMC is an out-of-box tool to change that. We will go through a few customer sample cases showcasing how we can minimize spent time, and resources as well as enhance various laser micromachining applications.

10:00-10:30
Advanced laser triggering for increasing throughput in laser micromachining.
Xavier Wolters, Amplitude (NL)

10:30-11:00
Versatile GHz Burst-Mode Operation in High-Power Femtosecond Laser
Dr. Tadas Bartulevičius, EKSPLA (LT)
A new versatile patent-pending method to generate ultra-high (>2 GHz) repetition rate bursts of ultrashort laser pulses containing any number of pulses within a burst with identical pulse separation and adjustable amplitude is introduced in industrial-grade 30 W-level average power ultrashort (sub-1 ps) pulse laser system.

11:30 – 13:00
Session 5: Main presentations

11:30-12:00
SSAIL: new technology for selective metal plating on dielectrics
Valdemar Stankevič, Akoneer (LT)
Demands for difficult electronic devices is increasing rapidly, driving a revolution in electronics printing on various materials. The recently developed SSAIL (Selective surface activation induced by laser) technology allows the placement of copper tracks on most polymer and glass materials. This technology has great potential in the automotive, aerospace, lighting, computing, or even medical sectors to improve the denser packing of electronics in a device.

12:00-12:30
Laser dicing technologies for semiconductor industry
Egidijus Vanagas, Evana Technologies (LT)

Developed technologies for high speed (up to 2000 mm/s) dicing of thin (up to 150 mm thick) semiconductor wafers.

• ICICLE technology for high density microelectronics devices chip singulation on silicon (Si) wafer. Dicing of more thick Si wafer (up to 700 µm), speed is up to 600 mm/s, high accuracy, high throughput, no chipping, no debris, easy breaking.
• Thermal Laser Cleaving (TLC) technology for high power (HP) and Radio Frequency (RF) microelectronics devices chip singulation on silicon carbide (SiC) wafer (back side metal coated). Dicing of more thick SiC wafer (up to 500 µm), speed is up to 600 mm/s, high accuracy, high throughput, no chipping, little debris, easy breaking.
• Tools: the hardware and software to dedicated optical engines for both technologies are provided, demonstrations on commercial basis are possible.
• the techniques allows straight and curved cleaving and breaking of the wafers.

12:30-13:00
Tunable GHz and MHz femtosecond burst for various material processing
Martynas Barkauskas, Light Conversion (LT)

High pulse energy femtosecond lasers PHAROS and CARBIDE with flexible BiBurst functionality bring new production capabilities to high-tech manufacturing industries such as consumer electronics, integrated photonic chip manufacturing, stent cutting, surface functionalization, future displays manufacturing and quantum computing.
BiBurst material fabrication areas cover:

•  brittle material drilling and cutting
• deep engraving
• selective ablation
• transparent materials volume modification
• hidden marking
• surface functional structuring.

13:00 – 14:00
Lunch

14:00 – 15:30
Session 6: Short presentations

14:00-15:30
Short presentations of participants

14:00-14:15
State-of-the-art in femtosecond fiber lasers
Dr. Jaroslaw Sperling, Menlo Systems GmbH (DE)

A quick introduction of Menlo Systems in general and our proprietary figure 9® femtosecond fiber laser technology in particular – complemented with application showcases ranging from THz generation to 3D nano-printing.

14:15-14:30
The IN GLASS Technology; a fs-Laser Microprocessing Solution
Sandro M.O.L. Schneider, Yalosys  Ltd. (CH)
Ultra Short Puls Lasers experience a stormy revolution and move from lab to real production plants.
The applications are manifold and still to be discovered. One highly promising application is the modification of transparent materials in wafer or other size and material like glass, sapphire, diamond. This leads to new applications and solutions in the field of miniaturization and long term stability of Microsystems, Microoptics or even Biosystems, due to the capability to seal the sensitive parts IN GLASS. However the USP-Laser processes are not the only challenges to over come to set up a reliable and economic way to produces glass chips economically and in high volumes. The qualification and metrology has also to be setup for very new device. This is the mission of Yalosys/Switzerland.

14:30-14:45
Standa Mechatronic system development tendencies and its integration into high performance technological machines in fields of: photonics, metrology, micromachining and semiconductors
Artur Piščalov, STANDA (LT)
Brief introduction into modular and non-modular approaches of Cartesian style robot architecture and its performance in high technological level machines.
Discussion about advantages and disadvantages of different implementation strategies and possible outcome.

14:45-15:00
Opportunities for companies and networking
Renata Norbutaitė-Jurienė, TOOLAS (LT)
Cluster opportunities and international networking for successful international business.

15:00-15:15
Medical lasers for micromachining? What will we do next?
Dr. Saulius Frankinas, QS Lasers (LT)

15:15-15:30
EuroLCDs
Edmunds Zutis, EuroLCDs (LV)

09:30 – 11:30
Visit to companies

9:30-12:00
Visits to companies in LITEK area
List of possible companies to visit: FTMC, EKSPLA, Litilit, etc.

12:00 – 15:00
Visit to companies

12:00-15:00
Visits to companies in Saulėtekis
Light Conversion