Silicon wafer laser scribing: laser technology with no substrate chipping

Published by TOOLAS on

TOOLAS has successfully conducted a process of silicon wafer laser scribing. TOOLAS applied its patented laser technology ICICLE to thin silicon wafers. Effective cooperation with Center for Physical Sciences and Technology (FTMC) resulted in a process with no substrate chipping and peeling of semiconductor wafer and coating layers.  This application is a solution to use when ordinary mechanical cutting (most common in the semiconductor industry) is not appropriate.